Wafer pickup type high-speed handler 'RS-evo'
Supports thin products with a minimum size of 0.4×0.2mm and a thickness of 0.1mm or less.
The "RS-evo" is a high-speed handler for wafer pickup designed for WLCSP and bare die, compatible with 12-inch wafers. As a pickup handler for 12-inch wafers, it achieves 70,000 UPH (70,000 units per hour). It also supports six-sided visual inspection. Please feel free to contact us if you have any inquiries. 【Features】 ■ Damage-free transfer (patented technology) ■ Supports ultra-small WLCSP and bare die (0.4×0.2mm) ■ Micro-crack detection through six-sided visual inspection (IR inspection available as an option) ■ Integration of electrical testing is also possible *For more details, please download the PDF or feel free to contact us.
- Company：上野精機
- Price：Other
